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What is High-Density Packaging (HDP)?
HDP comprises all technologies that increase the packaging density of today's electronics systems. The
foremost representatives are all direct chip attachments (especially wire bonding and flip chip), but also chip size/scale packages and other fine pitch components. This high interconnect density requires also very
demanding substrate and PCB types, such as thinfilm, ceramics, and SBU. With these technologies a new
generation of subsystems and systems is available featuring
cost reduction at system level;
increased functionality while reducing size and weight;
reduced power consumption;
better electro magnetic compatibility and improved signal performance;
higher modularity and reusability of subsystems.
The pictures from HDP samples below exemplify these benefits: