HDP Group
HDP Group ETH Zurich
[an error occurred while processing this directive]
HDP Home
IfE
What is HDP?
Activities
Staff
Publications
Calendar
Links
Internals



Publications of the HDP Group


1995 1996 1997 1998 1999 2000 2001 2002 2003

2003

Eletrical Characterization of Textile Transmission Lines, D. Cottet, J. Grzyb, T. Kirstein, G. Tröster, in IEEE Transactions on Advanced Packaging, May, Vol. 26, No. 2, pp. 182-190, 2003.

An Investigation of the Material and Process Parameters for thin-film MCM-D and MCM-L Technologies up to 100GHz, Janusz Grzyb, Ivan Ruiz, Gerhard Tröster, to appear in Proc. 53rd Electronic Components and Technology Conference (ECTC 2003), Hotel Sheraton, New Orleans, Louisiana USA, 27-30 May, 2003.

Extraction of Material Complex Permittivities for Composite Substrate MCM-L Technologies up to 100GHz, Janusz Grzyb, Ivan Ruiz, Gerhard Tröster, to appear in Proc. 7th IEEE Workshop on Signal Propagation on Interconnects (SPI 2003), Hotel Garden, Siena, Italy, 11-14 May, 2003.

Interconnects and Integrated Passives for a Single-Substrate 77GHz Automotive Radar, Denis Chouvaev, Gunnar Filipsson, Joacim Haglund, Janusz Grzyb, Didider Cottet, Ivan Ruiz, Maciej Klemm to appear in Proc. 14th European Microelectronics and Packaging Conference & Exhibition (IMAPS Europe 2003), Friedrichshafen, Germany, 23-25 June 2003.

2002

MCM-D Technology for Realisation of Low Cost System-on-Package Concept at 60-80 GHz, Janusz Grzyb, Ivan Ruiz, Maciej Klemm, Gerhard Tröster, in Proc. 11th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2002), Hyatt Regency Monterey, Monterey, California, October 21-23, 2002.

Quasi-CPW Lines on MCM-D for the Realisation of Via-less Transmission Elements and Distributed Passives, Janusz Grzyb, Ivan Ruiz, Maciej Klemm, Gerhard Tröster, in Proc. 11th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2002), Hyatt Regency Monterey, Monterey, California, October 21-23, 2002.

Characteristic Impedance Deembeding of Printed Lines with Probe-tip Calibrations, Janusz Grzyb, Gerhard Tröster, in Proc. 32nd European Microwave Conference, Milan, Italy, September 23-26, 2002.

Accurate Prediction of Microstrip Impedance and Attenuation at MM-Wave Frequencies, Didier Cottet, Janusz Grzyb, Gerhard Tröster, in Proc. 35th Annual Symposium on Microelectronics (IMAPS2002), Denver Colorado Convention Center, USA, September 4 - 6, 2002.

A Novel, Zone Based Process Monitoring Method for Low Cost MCM-D Substrates Manufactured on Large Area Panels, D. Cottet, M. Scheffler, G. Tröster, in Microelectronics Reliability, Elsevier, vol. 42, no. 3, pp. 417-426, August 2002.

Systematic Deembeding of the Transmission Line Parameter on High-density Substrates with Probe-tip Calibration, Janusz Grzyb, Didier Cottet, Gerhard Tröster, in Proc. 52nd Electronic Components & Technology Conference (ECTC2002), pp. 1051-1057, San Diego, CA, USA, May 28 - 31, 2002.

Deembeding of the Taper-fed CPW and Microstrip Lines Characteristic Impedance with Probe-tip Calibration, Janusz Grzyb, Gerhard Tröster, in Proc. 6th IEEE Workshop on Signal Propagation on Interconnects (SPI2002), pp. 83-86, Castelvechhio Pascoli, Pisa, Italy, May 12-15, 2002.

S-Matrix versus ABCD Chain Matrix Formulation in Probe-tip Calibration, Janusz Grzyb, Gerhard Tröster, in Proc. 6th IEEE Workshop on Signal Propagation on Interconnects (SPI2002), pp. 165-168, Castelvechhio Pascoli, Pisa, Italy, May 12-15, 2002.

Electronic Textiles for Wearable Computing Systems, Tünde Kirstein, Jose Bonan, Didier Cottet, Gerhard Tröster, in Proc. Hightex 2002 Conference, Saint-Hyacinthe, Canada, April 23, 2002.

2001

Virtual Prototyping for High Density Packaging Systems, E. Hirt, M. Scheffler, G. Tröster, in IEEE Transactions on Advanced Packaging, August, Vol. 24, No. 3, pp. 392-400, 2001.

On LAP Process Tolerances and their Impact on Cost and RF Performance, Michael Scheffler, Didier Cottet, Gerhard Tröster, Philippe Poyet, and Gerard Tessier, in Int. Journal of Microcircuits and Electronic Packaging, vol. 24, no. 1, pp. 45-52, 2001.

A simplified yield modeling method for design rule trade off in interconnection substrates, M. Scheffler, D. Cottet, G. Tröster, in Microelectronics Reliability, Vol. 41/6, Elsevier Science, June 2001, pp 861-869.

LAP: Low Cost Large Area Panel Processing of MCM-D Substrates and Packages - Achievements and Results M. Scheffler, D. Cottet, J. Grzyb (ETH Electronics Lab, CH), K. Delaney (NMRC, IE), N. Ammann, W. Preyss, J. Baumbach (tyco electronics, DE), P. Poyet, G. Tessier (Thomson-CSF Microelectronique, FR), P. Bodö, P. Leisner (Acreo AB, SE), U. Wahlstrom, S.-T. Persson, L. Ljungqvist (Strand Interconnect AB, SE), W. Wendel (Hirschmann Rheinmetall, DE), T. Centro (CAEN Microelettronica, IT), and P. Demmer (SIEMENS CR, DE), in Proc. InterPACK '01, Hawaii, USA, July 8-13, 2001.

MM-Wave Microstrip and Novel Slot Antennas on Low Cost Large Area Panel MCM-D Substrates-a Feasibility and Performance Study, J.Grzyb, D.Cottet, G.Tröster, in Proc. ECTC 2001

Experimental Analysis of Design Options for Spiral Inductors Integrated on Low Cost MCM-D Substrates, Didier Cottet, Janusz Grzyb, Michael Scheffler, Gerhard Tröster, in Proc. 51th Electronic Components & Technology Conference (ECTC2001), Lake Buena Vista, Florida, USA, May 29 - June 1, 2001.

Comparison of two cost analysis tools used to estimate the manufacturing cost HDI substrates, Pascal Guilbault, Peter Bodö, Michael Scheffler, in Proc. IMAPS Europe 2001, Strasbourg, FRANCE, May 29-31, 2001.

Integrated Passive Elements on Low Cost MCM-D Substrates, J.Grzyb, D.Cottet, G.Tröster, in Proc. HDI 2001, Santa Clara CA, USA.

Distributed Elements and MM-Wave Characterization of Low Cost MCM-D Substrates, J.Grzyb, D.Cottet, G.Tröster, in Proc. HDI 2001, Santa Clara CA, USA.

2000

Assessing the Cost Effectiveness of Integrated Passives, Michael Scheffler, Gerhard Tröster, Joaquin Lopez Contreras, Jürgen Hartung, Michel Menard, Microelectronics International, Vol. 17, Iss. 3, MCB University Press, Bradford West Yorkshire, UK, October 2000, p.11-15.

MM-Wave Integrated Antennas on Low-Cost MCM-D Substrates, Janusz Grzyb, Didier Cottet, Gerhard Tröster, Proc. 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2000), Scottsdale AZ, USA, October 23-25, 2000, p.269-272.
Paper in PDF (1MB)

A Multi-Objective Test vs. Cost Optimization for Electronic Products, Michael Scheffler, Gerhard Tröster, Proc. 26th IEMT 2000, Santa Clara CA, USA, October 2000, p.344-351.

Does Low Cost Large Area Panel Processing mean Low Performance?, Michael Scheffler, Didier Cottet, Gerhard Tröster, Proc. IMAPS Annual Symposium 2000, Boston MA, USA, September 2000, p. 217-222.
Paper in PDF (141kB)

New Process Monitoring Strategies for Large Area Panel Processing, Didier Cottet, Michael Scheffler, Gerhard Tröster, Proc. IMAPS Annual Symposium 2000, Boston MA, USA, September 2000, p.166-171.
Paper in PDF (418kB)

On the Impact of Design Rules to High Density Substrate Yield, Michael Scheffler, Didier Cottet, Gerhard Tröster, Proc. IMAPS Europe 2000, Prague, CZ, June 18-20, 2000, p.1-6.
Paper in PDF (630kB)

A 9:4 Satellite Switch at 2.5GHz, Etienne Hirt, Michael Scheffler, Gerhard Tröster, Wolfgang Wendel, Ralf Epple, Proc. IMAPS Europe 2000, Prague, CZ, June 18-20, 2000, p.157-162.

Integrated RF Components on Low Cost MCM-D Substrates, Didier Cottet, Janusz Grzyb, Benedikt Oswald, Michael Scheffler, Gerhard Tröster, Proc. IMAPS Europe 2000, Prague, CZ, June 18-20, 2000, p.212-215.
Paper in PDF (230kB)

A 9:4 Satellite Receiver Switch in MCM-C/D Technology, Etienne Hirt, Michael Scheffler, Gerhard Tröster, Geert Bernaerts, Wolfgang Wendel, Ralf Epple, Proc. HD International, Denver CO, USA, April 25-28, 2000, p.542-546.

Assessing the Cost Effectiveness of Integrated Passives, Michael Scheffler, Gerhard Tröster, Design Automation and Test in Europe (D.A.T.E. 2000), Paris, FRANCE, March 27-29, 2000, p.539-543.

Test vs. Cost Tradeoff for a Data Acquisition Chain, Michael Scheffler, Gerhard Tröster, Riccardo Mariani, Simone Giovanetti, Silvano Motto, Alfredo Benso, Paolo Prinetto, IEEE/IMAPS 2nd International Workshop on Chip-Package Codesign (CPD2000), Zurich, CH, March 14 and 15, 2000, p.41-45.

The Impact of Low Cost High Density Substrates on RF Structure Integration, Didier Cottet, Janusz Grzyb, Gerhard Tröster, IEEE/IMAPS 2nd International Workshop on Chip-Package Codesign (CPD2000), Zurich, CH, March 14 and 15, 2000, p.88-92.
Paper in PDF (141kB)

A TradeOff between Integrated Passives and SMD Components, Michael Scheffler, Gerhard Tröster, Proc. 6th European Conf. on MCMs (EC-MCM 2000), Hammersmith, London, UK, January 24 and 25, 2000.

1999

RF Characterization of Low-Cost MCM-D Substrates Manufactured on Large Area Panels, Didier Cottet, Michael Scheffler, Janusz Grzyb, Benedikt Oswald, Gerhard Tröster, Proc. 8th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'99), San Diego CA, USA, November 25-27, 1999, p.115-119.
Paper in PDF (80kB)

Early footprint comparison for Area I/O Packages and first level interconnect, Etienne Hirt and Gerhard Tröster, Proc. Electronic Components and Technology Conference (ECTC'99), San Diego CA, USA, June 1-4, 1999, p. 1210-1216

Early Footprint Estimation for Area I/O Packages, Etienne Hirt and Gerhard Tröster, Proc. Surface Mount Technologies (SMT'99) Nuremberg, GERMANY, May 1999, p.25-34

SMD Passivkomponenten versus Integrierte Passive: Entweder Oder? (SMD passives vs. Integrated Passives: Hard decision or mixed technology), Michael Scheffler and Gerhard Tröster, Tutorial "Neue Aufbau- und Verbindungstechniken" (in german), Surface Mount Technologies (SMT'99), Nuremberg, GERMANY, May 1999

The use of Area I/O or a Look on Future Architectures, Etienne Hirt, Michael Scheffler and Gerhard Tröster, IMAPS Int. Conference on High Density Packages and MCMs HDP'99, Denver CO, USA, 1999, p. 339-344.

Improving World's smallest GPS: CSP vs. Wire Bond, Michael Scheffler, Etienne Hirt, Jean-Pierre Wyss and Gerhard Tröster, IMAPS Int. Conference on High Density Packages and MCMs HDP'99, Denver CO, USA, 1999, p. 97-102.

1998

Modeling and Optimizing the Cost of Electronic Systems, M. Scheffler, D. Ammann, A. Thiel, C. Habiger, and G. Tröster, IEEE Design + Test of Computers, , Vol. 15, No. 3, IEEE Computer Soc., Los Alamitos, CA, USA, July-September, 1998, p. 20-26.

The Potential of Area I/O for Future Processor Systems, E. Hirt, M. Scheffler, and J.-P. Wyss, IEEE Micro, Vol. 18, No. 4, IEEE Computer Soc., Los Alamitos, CA, USA, July - August, 1998, p. 42-49.
Show introduction.

Comparison of Two Pentium MCMs Implemented in MCM-D and COB Technology, P. Eggenberger, J.-P. Wyss, E. Hirt, C. Habiger, and G. Tröster, IEEE Workshop on VLSI and Microsystem Packaging Techniques and Manufacturing Technologies, Brugge, Belgium, May 4-5, 1998.
Show abstract.

MOE - A Modular Optimization Environment for Concurrent Cost Reduction , M. Scheffler, D. Ammann, A. Thiel, C. Habiger, and G. Tröster, Proc. of the 5th European Concurrent Engineering Conference (ECEC'98), Erlangen, Germany, April 26 - 29, 1998

A Comparative Analysis of RF-Characteristics of High Density MCM-L Technologies, A. Thiel, C. Habiger, and G. Tröster, Multichip Modules and High Density Packaging Conference (MCM`98), Denver CO, USA, April 15-17, 1998.
Show abstract.

Design for test techniques for first-time right MCMs - exemplified by a Pentium MCM system, J.-P. Wyss, E. Hirt, C. Habiger, and G. Tröster, Multichip Modules and High Density Packaging Conference (MCM`98), Denver CO, USA, April 15-17, 1998.
Show abstract.

On the Impact of Area I/O on Partitioning: A new Perspective, E. Hirt, J.-P. Wyss, A. Thiel, D. Ammann, M. Scheffler, C. Habiger, and G. Tröster,IEEE International Workshop on Chip-Package Co-Design (CPD'98) , Zurich, Switzerland, March 24 - 26, 1998.
Show abstract.

Evaluating Cost Implications of New Technologies: A Modular Optimization Environment, M. Scheffler, D. Ammann, and A. Thiel, Proc. of IEEE International Workshop on Chip-Package Co-design (CPD'98), Zurich, Switzerland, March 24 - 26, 1998.

1997

Investigations on Novel Coaxial Transmission Line Structures on MCM-L, A. Thiel, C. Habiger, and G. Tröster, IEEE Multi-Chip Module Conference (MCMC`97), Santa Cruz CA, USA, Feb. 4-5, 1997, p.38-43.
Show abstract.

Transmission Lines in MCM-L Technology, A. Thiel, C. Habiger, and G. Tröster, Mikroelektronik '97, Munich, Germany, March 4-5, 1997.
Show abstract.

A Pentium based MCM for Embedded Computing, E. Hirt, J.-P. Wyss, C. Habiger, and G. Tröster, European Microelectronics Conference (EMC`97), Venedig, Italy, May 14-16, 1997
Show abstract.

RF-Characterization of Landless Via Structures in MCM-L Technology, A. Thiel, C. Habiger, G. Tröster, and T. Jakob, ISHM '97, Philadelphia PA, Oct. 12-16, 1997.
Show abstract.

1996

Performance of Advanced RF-Interconnect Structures on MCM-L, A. Thiel, C. Habiger, and G. Tröster, Wireless Communications Conference (WCC`96), Boulder CO, USA, Aug. 19-21, 1996.
Show abstract.

An MCM for Neural Network and similar Applications, J.-P. Wyss, E. Hirt, C. Habiger, and G. Tröster, Micro System Technologies MST`96, Potsdam Germany, Sept. 17-19, 1996
Show abstract.

CostAS - KGD Process Cost Modeling, D. Ammann, A. Thiel, C. Habiger, and G. Tröster, IEEE Innovative Systems in Silicon Conference (ISIS`96), Austin TX, USA, Oct. 9-11, 1996.
Show abstract.

MCM-L as a Cost-Effective Solution for High-Speed Digital Design, A. Thiel, C. Habiger, and G. Tröster, IEEE Innovative Systems in Silicon Conference (ISIS`96), Austin TX, USA, Oct. 9-11, 1996.
Show abstract.

1995

Teaching the Efficient Use of Hybrid-WSI Technology, A. Thiel, C. Habiger, M. Thaler, and G. Tröster, International Conference on Wafer Scale Integration WSI`95, San Francisco CA, USA, Jan. 18-20, 1995.
Show abstract.

Ein neuer Ansatz zur Kostenreduktion bei Multi-Chip Modulen, A. Thiel, D. Ammann, C. Habiger, and G. Tröster, German ISHM-Conference 1995, Munich, Germany, Oct. 23-24, 1995.
Show abstract.
English Translation: A Novel Cost-Modeling Approach for Multi-Chip Modules
Show abstract of the english version.
 
last change: 2003-10-20 hdp-webmaster
http://www2.ife.ee.ethz.ch/hdp/publications.html